From bare die to packaged device and iModuleTM, RF Power backend assembly plays unique and critical role for cost, quality and yield control. As the leading commercial RF Power production line in China, ZONKY with 1000m2 cleaning room. This advanced assembly line is equipped with fully automated machines including die kitting, die attach, wire bonding, lid sealing, DC/RF test, packing and marking, supported by key functionalities such as visual inspection, plasma cleaning, die shear testing, bonding strength testing, gross leak check and Nitrogen storage environment etc, with installed capacity 60Kpcs per month for open cavity devices and modules.
By leveraging our broad semiconductors offerings for LDMOS/GaAs/GaN and Si MOSCAP/MIMCAP, together with all key RF Power assembly methods, such as AuSn, Ag sintering, AuSi die attach, wedge and ball bonding, the advanced assembly line produces high precision and high quality packaged and module products.
These MOSFETs are specifically designed for radio frequency (RF) power applications. RF power MOSFETs are used in various industries, including telecommunications, aerospace, and industrial sectors. They are employed in power amplifiers, transmitters, RF generators, and other RF power applications. These MOSFETs provide efficient power conversion, high-frequency performance, and effective management of RF signals, making them essential components for RF power systems.